Compared with free silicon carbide cutting, the cutting efficiency of diamond wire can be improved into the following aspects:
The consolidation method, that is, brings more diamonds to participate in the grinding, and also reduces the mutual wear phenomenon between wear and tear.
The high hardness of diamond and the strong wear resistance of diamond will greatly prolong the service life of diamond wire.
The cutting line speed is high, the contact area between the diamond and the silicon wafer increases, and the diamond wire will be able to withstand other defects brought about by the high line speed, thus taking advantage of the high cutting speed.
The traditional mortar uses the rapid movement of the steel wire to bring the abrasive-containing liquid into the cutting seam of the workpiece, resulting in a cutting effect. During the cutting process, the silicon carbide is washed down, and only continuous rolling grinding is performed, which reduces the cutting efficiency and carbonization. The hardness of silicon is 9.5 (Mohs), while the hardness of diamond is 10 (Mohs), the cutting line speed of diamond wire is basically 15m/s, and the linear speed of our normal cutting mortar is basically 9-11.5m/s. And if the diamond wire makes another breakthrough. It should also be harder, with better self-sharpening (polycrystalline diamond), stable consolidation, and faster linear speed.
